THERMO-MECHANICAL RELIABILITY MANAGEMENT MODELS FOR AREA-ARRAY PACKAGES ON CU-CORE AND NO-CORE ASSEMBLIESAuthors: Pradeep Lall, Milan Shah, Luke Drake, Timothy Moore, Jeff Suhling
Company: Auburn University and Northrop Grumman Corporation
Date Published: 10/11/2007 Conference: SMTA International
Multivariate linear regression (MLR), and non-linear finite element models have been developed for prediction of geometry and material effects. MLR approach uses the potentially important variables from stepwise regression. The statistics models are based on accelerated test data acquired as part of this paper, in harsh environments, while finite-element models are based on damage mechanics and material constitutive behavior. Sensitivity relations for geometry, materials, and architectures based on statistical models, and FEA models have been developed. Convergence of statistical, failure mechanics, and FEAbased model sensitivities with experimental data has been demonstrated. Validation of model predictions with accelerated test data is presented.
Keywords: Ball grid array (BGA), design guidelines, solder joint fatigue, statistical model, thermal reliability prediction, Finite element models.
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