STENCIL PRINTING EVALUATION OF A 01005 COMPONENT BASED ON A STATISTICAL APPROACHAuthors: Sung Chul Joo and Daniel F. Baldwin, Ph.D., Weon Woo Nam, Ph.D.
Company: Georgia Institute of Technology and Samsung Techwin Co., Ltd.
Date Published: 10/11/2007 Conference: SMTA International
The goal of this paper is to apply the statistical approach from model validation to inferences to the 01005 component stencil printing evaluation and to examine the effect of process parameters on the solder paste release efficiency and the process capability. First, through a gage repeatability and reproducibility (GR&R) study, the inspection system is found to be acceptable for measuring solder deposit volume for 01005 components.
Electroformed stencil tends to be better than laser cut stencil in terms of solder paste release efficiency by between 14% and 30% of the aperture volume with confidence level of 95%. An aperture size designed as 110% of the pad size can have the mean solder deposit volume as between 89% and 144% with 95% confidence level. There are no differences between 90% and 100% and between 100% and 110% of aperture design in the solder paste release efficiency with at least 95% family confidence level. Based on the fractional factorial design experiment, the low print speed of 10 mm/s and the high release speed of 25 mm/s should be selected within the process levels studied in order to produce the maximum solder release efficiency of between 110% and 129% with 95% confidence level. Finally, the process capabilities (Cp) are shown to be equal for all the process factor levels considered based on the experiment performed.
Key words: stencil printing, 01005, electroformed stencil, lead-free solder, DOE, solder paste
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