SMTA International Conference Proceedings


Authors: Allen W. Duck and Claus Zabel
Company: A-Tek llc and Asscon
Date Published: 10/11/2007   Conference: SMTA International

Abstract: SMT as a process today is invariably associated with Convection Reflow in the minds of most people. If you are old enough and cast your mind back you will remember that Vapor Phase Technology had a significant part to play making the industry we know today possible. Early I.R systems cooked more than they reflowed and the capacity to manage temperature transfer through gaseous mediums simply was not available.

As the name suggests Vapor Phase is a technology that uses the temperature differential between a hot liquid vapor and a cooler PCB substrate to illicit an energy transfer from one to the other thus raising the temperature of the cooler PCB to that of the Vapor – never exceeding it. And there in lies one of its greatest strengths.

Keywords: Latent heat transfer, perfluoropolyether, high mass PCB.

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