THE EFFECT OF PROCESS VOIDING ON BGA SOLDER JOINT FATIGUE LIFE MEASURED IN ACCELERATED TEMPERATURE CYCLINGAuthors: Sundar Sethuraman, Richard Coyle, Richard Popowich, and Peter Read
Company: Alcatel-Lucent and Solectron Corporation
Date Published: 10/11/2007 Conference: SMTA International
This work employs methods developed in a previous investigation to generate macrovoiding patterns that can be used to assess voiding and solder fatigue life. The test vehicle consists of a 0.5 mm pitch SnPb chip scale package (CSP) and blind microvia in pad board mounting. The voiding and void distributions are controlled through various combinations of surface mount reflow parameters and surface finish. Long term fatigue life is evaluated using typical IPC-9701 test conditions for accelerated temperature cycling (ATC). Voiding is characterized using automated Xray inspection and failed solder joints are examined with optical microscopy. The fundamental conclusion of the study is that voiding can reduce the interconnect fatigue reliability but that void location, not void size or volume fraction, has the primary impact on fatigue life.
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