A STUDY OF 0201’S AND TOMBSTONING IN LEAD-FREE SYSTEMSAuthors: Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta
Company: Jabil Circuit, VI Technology and Cookson Electronics
Date Published: 10/11/2007 Conference: SMTA International
A comprehensive DOE was undertaken to characterize tombstoning of 0201 components in different metallurgical solder systems. Factors included pad geometry, board finish, stencil geometry, solder paste type, print and placement offsets, and reflow profile and atmosphere. The experiment was divided into two phases; the results of Phase 1 are analyzed and reviewed.
Key words: Lead-free, miniaturization, tombstoning, reflow, 0201 components
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