USING SIX SIGMA TECHNIQUES TO OPTIMIZE CLEANING IN CLASS III ELECTRONICSAuthors: Mike Bixenman, Tom Gervascio, and Ronald Lasky, Ph.D., PE
Company: Kyzen Corporation, Sypris Electronics, and Indium Corporation
Date Published: 10/11/2007 Conference: SMTA International
Inline cleaning processes have been developed to address the cleaning needs of these high reliability Class III electronics assemblies. Coupled with the need to reduce cycle times, the cleaning process must provide for reliability through efficient cleaning and yet allow for optimum production throughput. As a result, the cleaning process is typically given only a short process window to penetrate, dissolve, and remove the flux residue from these complex electronic assemblies. To address this problem, upstream cleaning process conditions must be optimized. A designed experiment was performed to accomplish this task. The data generated from the designed experiment provided the basis for modifying the manufacturing process to meet the cleaning objectives. This paper will discuss in detail the work that supported and achieved these required cleaning objectives.
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