SMTA International Conference Proceedings


Authors: Mike Bixenman and Steve Stach
Company: Kyzen Corporation and Austin American Technology
Date Published: 10/11/2007   Conference: SMTA International

Abstract: Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge. Understanding the balance between static chemical and mechanical driving forces is fundamental to predicting and optimizing process variables.

The objective of this research is to improve the science of cleaning under low standoff components. The research will encompass three designed experiments to study nozzle designs, test simulations, and verification in industry standard cleaning equipment. Phase I of this research studies nozzle design cleaning effects for penetrating and removing flux residue under low standoff components. The nozzle cleaning effects were studied using a Cleaning Analyzer Recording Lab that provides video evidence of six different nozzle types.

In this study, two industry suppliers with the cooperation of industry experts at Lockheed Martin seek to understand impingement and fluid flow effects for penetrating and removing flux residue under low standoff components. The testing was done on glass substrates that were bumped using anisotropic epoxy. Glass slides were placed over the die. High solids flux residue was dispensed and reflowed using a ramp to spike Pb-free profile. The test simulations were videoed to learn the fluid flow characteristics required to penetrate and remove flux residue under low standoff components.

Key words: Cleaning process, Cleaning, Cleaner

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