INVESTIGATION INTO THE MASS IMAGING ASPECTS OF 0.3mm WAFER LEVEL CHIP SCALE PACKAGE SOLDER PASTE DEPOSITIONAuthor: Clive Ashmore
Company: DEK Printing Machines, Ltd.
Date Published: 10/11/2007 Conference: SMTA International
This paper will present results from research into the key influential elements of the deposition process. Process design factors such as solder paste, stencil design, stencil fabrication are fully investigated. In addition, the impact of typical production defects associated with the fabrication of stencils will be observed to ensure that the study presents real-world, as opposed to laboratory, process conditions. The deliverables from this paper will be clear and concise implementation solutions for surface mount engineers who will be required to assemble 0.3mm pitch CSPs.
Keywords: 0.3mm pitch CSP, chip scale package, fine pitch, stencil print, laser cut, electroformed, solder paste.
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