Medical Electronics Symposium Conference Proceedings


VIA RELIABILITY – A HOLISTIC PROCESS APPROACH

Authors: David L. Wolf, Timothy A. Estes, and Ronald J. Rhodes
Company: Conductor Analysis Technologies (CAT), Inc.
Date Published: 5/3/2007   Conference: Medical Electronics Symposium


Abstract: New materials and processes are being developed and introduced to the printed circuit industry with the objective of ensuring the reliability of via interconnects under the harsh conditions required for lead-free assembly. In order to validate the “goodness” of these materials and processes, reliability studies must be performed. However, these studies are often based upon a small number of samples, and the samples may or may not have been produced with the same set of manufacturing processes intended for the production product. Furthermore, the samples must be produced from a controlled and capable process in order for the reliability results to be valid.

The IPC PCQR2 Database provides a holistic approach to understanding the capability of the materials, equipment, and processes used in the manufacture of printed circuit boards. Furthermore, the quality and reliability of printed circuit boards fabricated under these conditions is established. This presentation will summarize recent findings of the impact of lead-free assembly on via reliability and provide case studies documenting the need for controlled, capable and uniform printed circuit manufacturing processes.

Key words: Via interconnects, via reliability, lead-free, IPC PCQR2 Database, process capability.



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