Surface Mount International Conference Proceedings


COMPUTATIONAL MODELING OF DIRECT MOLTEN SOLDER DELIVERY FOR BALL GRID ARRAY APPLICATIONS

Author: M. Essien
Company: Sandia National Laboratories
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Computational modeling has been performed to determine optimum operational parameters for a piston-driven molten solder jetting device used to create array interconnects for BGA applications. The device is capable of delivering a 20 x 20 array of 600-800 pm diameter molten 60Sn 40Pb solder droplets onto an array of copper pads, and primarily consists of an electromechanically-driven piston, a heated reservoir, and an orifice plate. Computer simulations were performed to determine the relationship between the amplitude and the rate of piston displacement, the onset of fluid “pinch-off,” and the production of satellite droplets. Results show that stable droplets are generated when the volume of the displaced fluid has a spherical diameter that is approximately equal to the orifice diameter. Key Words: Ball Grid Array, solder delivery, computational fluid dynamics



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