IWLPC (Wafer-Level Packaging) Conference Proceedings


GEOMETRY AND BOND IMPROVEMENTS FOR WIRE BALL BONDING AND BALL BUMPING

Authors: Daniel D. Evans, Jr.
Company: Palomar Technologies, Inc.
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA, and digital cameras continue to merge into a common device that will benefit from finer pitch and lower profile wire bonding or ball bumping for flip chip, stacked chip, and other advanced packaging technologies. Inherent variations in materials, tools, and process can cause variations in ball shape and size, stitch shape, bond quality, and thus yield.

This paper will present Adaptive Bond Deformation™, a method developed to control the geometry of both ball and stitch according to process parameter inputs supplied by the user. This technique adapts to normal variations in bond surface, bond tool coupling, part fixture, and other difficult-to-measure influences to produce bonded ball bumps and stitches with significant improvement in geometry consistency with similar or better results for ball shear and pull strength when compared to non-adaptive bonding. This paper provides a detailed proof of ball bump geometry improvements and case examples where this new technique is applied to wire stitch bonds.

Key words: Ball Bump, Stud Bump, Wire Bond, Co-Planarity, GGI, Yield, and Traceability.



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