0.2MM BALL PLACEMENT FOR 0.3MM PITCH WAFER LEVEL CSPsAuthor: Tom Falcon
Company: DEK Printing Machines Ltd.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
However, even the diminutive WLCSP can be made smaller, and so the next generation package will soon be upon us. Most likely to take the form of a 0.3mm pitch ball array, this new package will no doubt create significant assembly challenges for the semiconductor packaging foundry, one of the greatest being how to reliably and repeatably place 0.2mm solder balls on a 0.3mm pitch, with a high yield and a high throughput.
This paper will describe a method of wafer level solder ball placement, and propose a working solution for 0.2mm solder ball placement onto 200mm silicon wafers, thereby enabling the high volume production of next generation 0.3mm pitch WLCSPs.
Keywords: Ball placement, ball attach, DEK, wafer level, CSP.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.