IWLPC (Wafer-Level Packaging) Conference Proceedings


0.2MM BALL PLACEMENT FOR 0.3MM PITCH WAFER LEVEL CSPs

Author: Tom Falcon
Company: DEK Printing Machines Ltd.
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Driven by consumer demand for ever greater functionality from even smaller portable electronic devices, the continued miniaturisation of advanced semiconductor packages is inescapable. This trend has already taken us to one logical conclusion and the “Wafer Level” CSP is now becoming the package of choice. WLCSPs are effectively no bigger than the silicon chip itself, and are, in many ways already the ultimate in miniaturised performance. They provide the shortest and therefore fastest electrical signal path, the lowest packaging costs, and have already proven their reliability in a variety of applications.

However, even the diminutive WLCSP can be made smaller, and so the next generation package will soon be upon us. Most likely to take the form of a 0.3mm pitch ball array, this new package will no doubt create significant assembly challenges for the semiconductor packaging foundry, one of the greatest being how to reliably and repeatably place 0.2mm solder balls on a 0.3mm pitch, with a high yield and a high throughput.

This paper will describe a method of wafer level solder ball placement, and propose a working solution for 0.2mm solder ball placement onto 200mm silicon wafers, thereby enabling the high volume production of next generation 0.3mm pitch WLCSPs.

Keywords: Ball placement, ball attach, DEK, wafer level, CSP.



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