Surface Mount International Conference Proceedings


A NEW BGA PACKAGE FOR HIGH DENSITY APPLICATIONS

Author: Robert Darveaux
Company: Amkor Electronics
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: A new Ball Grid Array (BGA) package has been developed by Amkor/Anam for high density applications. The device has a die-up wire-bonded configuration with a flex circuit substrate and an over-molded body. The package outline is similar to a standard PBGA. The balls are arranged in a 4 row perimeter array with additional center balls for enhanced heat transfer. In this paper we present both analytical and experimental results on substrate design, motherboard routing, electrical performance, thermal performance, package level reliability, reliability.



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