IWLPC (Wafer-Level Packaging) Conference Proceedings


Authors: Alec J. Babiarz and Horatio Quinones
Company: Asymtek
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Jetting liquid materials for semiconductor packaging enables assembly processes that were not possible with needle dispensing and in some cases stencil printing. Application of underfill by jetting for semiconductor packaging enables tighter packaging of multiple chips on substrates due to the small keep out areas that are now possible, while providing higher throughput than needle dispensing. Jetting of fluxes provides more consistency at thinner film builds than stencil printing. The accurate application of flux provides increased yield. The prospect of using shielded PoP assembly has been enhanced by jetting. The jet is able to apply small streams at high flow rates through holes in the RFI shields associated with cell phone applications and enabled cell phones to pass drop tests. This paper covers the enabling applications of jetting materials that provide cost effective packaging solutions.

Keywords Capillary, Jetting, LED, Splashing, Underfill, CSP, PoP

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