IWLPC (Wafer-Level Packaging) Conference Proceedings


NEW MATERIAL AND RELIABILITY ISSUES OF RE-DISTRIBUTION LAYERS

Author: Robert L. Hubbard
Company: Lambda Technologies, Inc.
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)


Abstract: With the expansion of wafer level packaging into a wider number of IC designs and multiple die packages, the use of multiple layers of polymer dielectric films has increased. The type and number of chemical resins used to make thin films on wafers has grown as well as options for their cure. Faster cure and lower temperature cure have become priorities but the choice between materials has not always been based on good information about the relationship between cure state and the resultant mechanical and chemical properties of the films. Reliability of films through subsequent processes and into product reliability testing has been adversely affected. Material and process selection criteria are suggested to minimize reliability issues.



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