STATE OF THE ART PROCESSING SCHEMES FOR BCBAuthors: C.Brubaker and T. Matthias et al.
Company: E.V. Group, Inc. and The Dow Chemical Co.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
One manner in which BCB is being used above and beyond its initial intent is as a bonding adhesive. BCB has been used in two manners. First, with patterned layers to define a gasket or seal ring to act as the bonding layer to create a sealed package. Second, in an unpatterned manner, such as to perform three-dimensional interconnect (3D Interconnect) bonds that allow the circuitry to two patterned devices to act in concert.
BCB is also being applied via spin and spray coating techniques to allow utilization in a number of additional areas. One such is to enable underfill of suspended structures such as air-bridges in an efficient manner. A second combines the use of spray coating and wafer bonding to allow sealing of etched cavities in place over mechanically critical elements such as MEMS devices (where the device wafer cannot be coated, and spin coating of the wafer with etched cavities is difficult).
KEYWORDS: BCB, Wafer Bonding, Spray Coating, Underfill, 3D Interconnect
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