IWLPC (Wafer-Level Packaging) Conference Proceedings


ULTRATHIN-WAFER PROCESSING UTILIZING TEMPORARY BONDING AND DEBONDING TECHNOLOGY

Authors: Thorsten Matthias and Chad Brubaker et al.
Company: EV Group Inc. and Brewer Science, Inc.
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)


Abstract: As semiconductor manufacturers continue to push the thickness of devices and wafers down, new and disruptive methods to meet the manufacturing challenges associated with new products and processes have to be utilized. Emerging products, such as radio-frequency identification tags, more-sophisticated chip cards, or ever-denser memory devices, along with the advent of new advanced packaging technologies for a variety of products ranging from logic to memory to image sensors, require increasingly thinner substrates.

The most promising and most widely investigated handling solution for ultrathin wafers is the use of temporary bonding and debonding techniques utilizing a carrier wafer to provide sufficient mechanical support. Once the product wafer is temporarily bonded to the carrier wafer, it is ready for backside processing including back-thinning, through-silicon via formation, etc. After completion of the backside processing steps, the product wafer can be released from the carrier wafer and proceed to final packaging processes.

In this paper a complete solution (equipment, material, and process) for thin wafer handling and processing is presented based on temporary bonding and novel adhesives by Brewer Science. This approach is compatible with product roadmaps to less than 25-micron wafer thickness and enables processing of the thin wafers in existing fabs without modification of the existing equipment.

Key Words: Temporary bonding, debonding, ultrathin-wafer processing, high-temperature adhesive, carrier wafer



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