ULTRATHIN-WAFER PROCESSING UTILIZING TEMPORARY BONDING AND DEBONDING TECHNOLOGYAuthors: Thorsten Matthias and Chad Brubaker et al.
Company: EV Group Inc. and Brewer Science, Inc.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
The most promising and most widely investigated handling solution for ultrathin wafers is the use of temporary bonding and debonding techniques utilizing a carrier wafer to provide sufficient mechanical support. Once the product wafer is temporarily bonded to the carrier wafer, it is ready for backside processing including back-thinning, through-silicon via formation, etc. After completion of the backside processing steps, the product wafer can be released from the carrier wafer and proceed to final packaging processes.
In this paper a complete solution (equipment, material, and process) for thin wafer handling and processing is presented based on temporary bonding and novel adhesives by Brewer Science. This approach is compatible with product roadmaps to less than 25-micron wafer thickness and enables processing of the thin wafers in existing fabs without modification of the existing equipment.
Key Words: Temporary bonding, debonding, ultrathin-wafer processing, high-temperature adhesive, carrier wafer
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