µPILR™ PACKAGE-ON-PACKAGE QUALIFICATION TESTING A Practical 3D Solution for Memory and Mixed Memory ApplicationsAuthor: Vern Solberg
Company: Tessera, Inc.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
The motivation for developing higher density IC packaging continues to be the portable phone market and the consumers’ expectation that each new generation of products furnish greater functionality. These miniature IC package innovations have proved ideal for a growing number of portable and hand-held electronic applications. The challenge electronic manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or cost.
The information presented in this paper will focus on the companies µPILR™ package platform, a very thin vertically configured package technology and the extensive qualification test program developed for a high volume stacked NAND Flash product. A key advantage of this package-on-package configuration is that each layer of the package can be pre-tested before joining. This capability greatly improves the overall manufacturing yield and the functional reliability of the final package assembly is assured. Although the material developed for this paper focuses on the development of a very thin 8-die FLASH memory product, the µPILR technology will likely be adopted for multiple function packaging for hand-held and portable electronic applications and a any number of mixed memory and mixed function variations.
Key words: µPILR, CSP, PoP, FLASH Memory
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