COMPLIANT WAFER LEVEL PACKAGE FOR ENHANCED RELIABILITYAuthors: Guilian Gao and Bel Haba et al.
Company: Tessera Inc. and Tessera Israel Inc.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
Tessera’s new compliant WLP technology greatly enhances thermal fatigue reliability. A compliant layer under the solder joints effectively minimizes thermo-mechanical stress between the die and the PCB. High reliability has been demonstrated on a 9mm x 14mm package. The prototype units exceeded 1600 cycles of temperature cycling from -40oC to 125oC. A compliant WLP package version with plated copper posts was also developed. This structure holds the promise to enable wafer level test and burn-in at a cost substantially lower than current WLBT technology, which requires expensive wafer contactors. Daisy chain continuity with wafers pressed directly against a test board has been demonstrated.
Key words: Compliant WLP, reliability, FEA, test, burn-in
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