HERMETIC, WAFER LEVEL, CAVITY PACKAGE COMPATIBLE WITH COB ASSEMBLYAuthor: G. Humpston et al.
Company: Tessera Inc.
Date Published: 9/17/2007 Conference: IWLPC (Wafer-Level Packaging)
Presented is a totally hermetic, cavity package, fabricated at the wafer level, suitable for MEMS and other devices. To simplify the package construction different materials and processes are used to affect the mechanical assembly and the hermetic seal. The package lid can be opaque or optically transparent. The cavity height is achieved by a picture frame spacer, so can range from microns to millimetres. The packaging process leaves the bond pads on the die exposed for probing and chip-on-board assembly. Initial reliability tests indicate it will meet market requirements and cost models predict it will be competitive with discrete packaging solutions.
KEYWORDS Wafer level package, hermetic, COB assembly
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