IWLPC (Wafer-Level Packaging) Conference Proceedings


PROSPECTIVE FUTURES FOR WAFERS, IC PACKAGES AND INTERCONNECTIONS

Author: Joseph Fjelstad
Company: SiliconPipe, Inc.
Date Published: 9/17/2007   Conference: IWLPC (Wafer-Level Packaging)


Abstract: In the world of electronics two elements found on the periodic table of elements presently dominate the electronic universe one is the semiconductor silicon and the other is copper the most ubiquitous of electrical and electronic conductors. Silicon in wafer form is used to create integrated circuits and copper is used to interconnect them. Over the course of the last almost 50 years, the electronics industry has seen some significant changes as it has progressed from relatively simple electronic products such as radios and televisions, which were relatively expensive on a relative basis in their time, to the countless highly complex, multifunction and relatively inexpensive electronics we see all around us today. That evolution has been made possible by mostly incremental but steady improvements in the materials and processes used in the manufacture of every element or piece of an electronic assembly, which include wafers and their integrated circuit offspring and the many interconnection technologies that serve to help interconnect them.

The American philosopher George Santayana observed that: “Those who cannot learn from history are doomed to repeat it.” That comment is true about history in all of its forms including that of the electronics industry and thus it is advisable to look back before looking forward.



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