Author: Marie S. Cole Company: IBM Microelectronics Date Published: 9/10/1996
Surface Mount International
Abstract: Initial reliability evaluations of any new packaging technology focus on the general mechanical integrity of the structure, particularly focused on the interconnections. Once the new technology has proven feasible, the reliability evaluations address additional, more application specific concerns such as durability through shock and vibration testing. Reliability testing of Ceramic Ball Grid Array (CBGA) and Ceramic Column Grid Array (CCGA) has followed the same path. Technology evaluations proved these packages viable through generic reliability tests. To offer system customers guidelines on the durability of CBGA and CCGA through shock and vibration, an experimental matrix was defined to determine technology limits. The goal was to assess the ability of the CBGA and CCGA interconnection to withstand Mil-STD impact shock and vibration conditions, evaluate any degradation in the thermal fatigue life of the solder joints resulting from shock and vibration, and determine the affect of heatsink weight.