Pan Pacific Symposium Conference Proceedings


UNVEILING THE NEXT GENERATION IN SUBSTATE TECHNOLOGY

Authors: Ron Huemoeller, Sukianto Rusli, Steve Chiang, Tsung Yuan Chen, Dave Baron, Lutz Brandt and Bernd Roelfs
Company: Amkor Technology, Inc., Unimicron Technology Corporation, and Atotech GmbH
Date Published: 1/31/2007   Conference: Pan Pacific Symposium


Abstract: The electronic packaging industry has been crippled by the incremental technology advancement produced by the substrate manufacturers over the past decade. While semiconductors and related packaging technologies progress at alarming rates, typically doubling in functionality every couple of years, the substrate portion of the integrated circuit (I.C.) packaging industry continues to fall further and further behind. This has created a significant technology gap, forcing the semiconductor manufacturers to compensate their chip design by adding more redistribution layers or even worse, additional size to the chip itself. Thus, the I.C. industry is in dire need of a significant change at the substrate level to remove the innovative barrier that exist today and allow chip designers to continue their efforts in reducing size and cost, while increasing the functionality. A collaborative effort between Amkor Technology, Unimicron and Atotech, has led to a significant new breakthrough in substrate manufacturing techniques, allowing both layer and format reduction (thus cost reduction) versus currently available state of the art technologies. The tremendous growth and need for a disruptive technology in I.C. substrates, has helped to facilitate the implementation of this new method that allows the miniaturization of both design features and substrate format. This innovative technology utilizes laser ablation techniques, together with specially developed plating processes, to form electrical paths for signal propagation within the dielectric, as opposed to conventional technologies that form signal paths above the dielectric. A close look at this technology reveals benefits and opportunity for significant gap closure to current needs in the chip packaging industry today. The laser structured approach offers a unique opportunity to simultaneously improve upon traditionally incremental improvements in design as well as optimize electrical performance at the same time by reducing signal paths. Ultimately, this approach addresses critical needs for the coming generations of chip packaged substrates by not only driving miniaturization in design, but also by improving the electrical performance of the package as well. This paper unveils the technology and benefits that the laser embedded approach provides. Key words: BGA, laser, embedded, excimer.



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