Surface Mount International Conference Proceedings


BUMPING PROCESS FOR 40-MIL PBGA

Author: R.T. Chen
Company: ITRI
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: The 40-rnil plastic ball grid array (PBGA) is a high efficiency, high I/0, high density package. Generally speaking, when the solder bump’s pitch moves from 60-rnil or 50-rnil to 40-mil, the solder pad and solder ball’s size will become smaller. In this experiment, we have four kinds of solder pad size and two kinds of solder ball diameter, which made eight different combinations. We focused on bumping ball yield first. In order to measure the difference, we setup a ball shear test with different parameter (shear speed, shear height) to quality the result. After the bumping process, we also mounted the component on the test board and measured the solder height and shape to gather more information on 40-mil PBGAs in the SMT process.



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