Pan Pacific Symposium Conference Proceedings


Author: Alec J. Babiarz
Company: Asymtek
Date Published: 1/31/2007   Conference: Pan Pacific Symposium

Abstract: The ability to jet liquid materials that have viscosities in excess of 20 centipoise has opened a new level of packaging miniaturization and enabling assembly technology for semiconductors and electronic components. Display components such as OLEDs, PLEDs, topside emission OLEDs, high definition LCOS, and DLP chips utilize UV adhesives, liquid crystal, desiccants, and conductive adhesives in high accuracy and minute quantities. Jetting underfill for semiconductor packaging provides high throughput with small keep out areas enabling cost effective flip chip assembly in FCIP assembly. The unique ability of jetting small streams at high flow rates has enabled cell phones to pass drop tests with Package on Package (PoP) assembly and enabled through shield application of CSP underfill material for -low cost, re-workable assembly. This paper will cover the enabling applications of jetting materials that has lead to new and cost effective assembly solutions.

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