CLEANING PROCESS CONSIDERATIONS FOR ADVANCED PACKAGING DEVICES AND ASSEMBLY
Authors: Thomas M. Forsythe and Michael Bixenman Company: Kyzen Corporation Date Published: 1/31/2007
Pan Pacific Symposium
Abstract: Advanced Packing design and capabilities continue to advance at a rapid rate with increase market demand for flip chip assemblies, which drives wafer level packaging. There has been significant evolution of both cleaning requirements and solutions over the past few years. As Flip Chip I/O counts continue to increase, reliability concerns have renewed design engineers interest to study the benefits of removing flux residue. The purpose of this paper reports advanced cleaning process research to open the process window when cleaning flux residues from beneath low stand off devices. The paper will focus on advanced cleaning fluid and mechanical impingement design factors that open the process window. Data will be presented from comprehensive, ongoing studies designed to evaluate the match between soldering and cleaning technologies across a broad range of process technology equipment options.