3D PACKAGING OF IMAGING AND MIXED FUNCTION ICs FOR NEXT GENERATION ELECTRONICS
Author: Vern Solberg Company: Tessera, Inc. Date Published: 1/31/2007
Pan Pacific Symposium
Abstract: According to the most recent forecast from prominent market research firms, the market for camera phones will increase to approximately 825 million units in 2009, representing a 21 percent compounded annual growth rate from 2005 . Because the market for these enhanced products is extremely spirited, rapid deployment of sub-system components becomes a key factor in capturing a competitive advantage. Likewise, the end user attracted to the new functionality are expecting that each generation of product to be smaller and lighter that its predecessor. Without expanding the product size, the manufacturer will need to rely more on functional integration. That is, combining a maximum number of functional features into a minimal number of sub-system components. The complex optics of next-generation high definition DVD players, game machines and drives, for example, represents applications where expanded capabilities to miniaturize and reduce cost will be critical. Combining silicon camera imaging with precision digital micro-optics technology, in particular, can provide key imaging solutions in a small package for a variety of high-growth and high-volume consumer optics applications. Micro-optics is defined as the use of microscopic structures to shape and influence light. These digital optics' technologies are already utilized in a number of applications including semiconductor equipment optics, communications and photonics and by providing specialty lenses and optical sub-assemblies for the semiconductor lithography and communications markets. The paper developed for the 2007 Pan Pacific Microelectronics Conference will focus on a 3D System-in-Package solution that includes a high resolution precision camera. The actual imaging system (camera) utilizes an innovative wafer level glass-silicon-glass sandwich structure to enable image-sensing capabilities through the packaging structure. The end result is a true chip-size package with X/Y dimensions identical to the original die size, and a total package thickness that is same as the original silicon thickness, ideal for 3D package stacking processes. Applications for miniaturization include; camera phones, light sensing, bar code readers, fax machines and digital scanners, photodiodes and medical devices.