PACKAGE ON PACKAGE (POP) PROCESS DEVELOPMENT AND RELIABILITY EVALUATION
Authors: Jonas Sjoberg, David A. Geiger, Todd Castello, and Dongkai Shangguan, Ph.D. Company: Flextronics International Date Published: 1/31/2007
Pan Pacific Symposium
Abstract: Traditionally, most of the miniaturization for Printed Circuit Board Assemblies (PCBA) has been accomplished by stacking bare dies inside the package, reducing the pitch of the package, and/or reducing the component and pad spacing on the Printed Circuit Board (PCB). There is a limit, however, on what can be done with regards to component pitch and spacing. Package on Package stacking (PoP), offers a new alternative for further miniaturization and densification of PCBA. This paper describes the PoP process requirement in general, the impact on mechanical reliability using different pad layouts and with/without underfill.