MOISTURE INDUCED STRESS SENSITIVITY REDUCTION OF FSRAM 52 LEAD PLCC’S
Authors: Armando H. Carrasco Company: Motorola Semiconductor Product Date Published: 9/10/1996
Surface Mount International
Abstract: A package improvement program was conducted in an effort to minimize the moisture induced stress sensitivity of the 52 lead PLCC (Plastic Leaded Chip Carrier), E48F, 32Kx18 BurstRAM at a subcontract assembly site. Newer technology molding compounds, die attach epoxy, and methods for reducing the back of the die contamination due to silicon wafer processing and package assembly were evaluated and characterized to enhance the interracial package integrity. This report summarizes the analysis of the data obtained and its use in selecting the best overall materials.