ACCELERATED STRESS TEST COMPARISON OF CURRENT CARRYING LIMITATIONS; FLIP CHIP VS GE EMBEDDED CHIP BUILD-UP
Authors: Ray Fillion, Charles Woychik, and Don Bitting Company: General Electric Date Published: 1/31/2007
Pan Pacific Symposium
Abstract: As the I/O count for high performance processors continues to grow from a few hundred of a few years ago to a few thousand today and approaches ten thousand in the upcoming generations a new failure mechanism is becoming a major performance limiter. Electromigration of the under bump metal (UBM) into the solder bump has become a major issue as the pad pitch and corresponding pad area continue to shrink. This paper will look at the causes of these failures and at a new family of embedded chip packaging approaches that eliminate this failure mechanism all together. Key Words: solder bumps, electromigration, embedded chip, Flip chip, BGA.