SnPb, Pb-FREE, AND BACKWARD COMPATIBLE SOLDERING PROCESSES OF HIGH-SPEED BGA CONNECTORS
Authors: Scott Priore, Hien Ly, and Doug Prosenik Company: Cisco Systems, Inc.,Jabil, Inc., and Hirose Electric Date Published: 1/31/2007
Pan Pacific Symposium
Abstract: Current Giga-bit switches, router systems, and other high-speed equipment typically contain various right angle or parallel sub-modules which increase functionality and / or features within the system. These interconnects between the main board and sub-modules are required to provide a reliable high-speed interface for up to 20 years of product life. Data rate, signal density, and manufacturability are now driving designs to incorporate a ball-grid array (BGA) form factor to meet customer’s demands. Many area array connectors in the market today have the necessary speed and area density; however, most offer challenges in the area of manufacturing during SMT, rework, inspection, and have potential reliability issues during the product service life. Keywords: Manufacturability, BGA, BGA connector, SMT backplane connector, Pb-free, mixed soldering, rework, reliability.