Pan Pacific Symposium Conference Proceedings


NEW CHALLENGES AND OPPORTUNITIES OF SYSTEM-IN-PACKAGE

Author: Anna Fontanelli
Company: Systems Design Division, Mentor Graphics Corporation
Date Published: 1/31/2007   Conference: Pan Pacific Symposium


Abstract: In 2005, the consumer has become the largest customer of the semiconductors industry, with a share in excess of 50%. This has been possible because the worldwide market is no longer limited to the two billion people who live in the western countries. By now, there are six billions prospective customers, all over the world. Consumer applications, though, demand an ever increasing integration of different silicon process technologies to meet their performance (power, clock), form factor and cost targets. A brand new IC/Package/Board co-design and co-verification methodology, based on open standards, and able to work in a 3D world, is required to address the integration of digital, analog, RF components of the application, developed in their native process technology, and combined with the required active and passive parts, into a single package, thus enabling the challenging System-in-Package (SiP) design technique. IC, package, and board have become a single whole, and must be treated as such to increase total system performance and promote right first time. Key words: SiP, SoP, Flip-Chip, Embedded Passives.



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