Pan Pacific Symposium Conference Proceedings


Author: Friedhelm Maur
Company: COMET Shanghai
Date Published: 1/31/2007   Conference: Pan Pacific Symposium

Abstract: During the past few years X-ray Test and Inspection has become a major part in the Quality control of Microelectronics and PCB assembly Industry. Advances both in X-ray tube technology and in X-ray detector technology have been made. Radioscopy has expanded and has established in many new fields that require quality control or process optimisation. Computer Tomography system have been developed to allow 3D inspection. With the transition to lead free interconnections and the corresponding changes in the solder process, the inspection has become more critical. This presentation illustrates numerous examples and applications where new X-ray components have been beneficially used in the Failure Analysis and Process Control of Microelectronics, Printed Circuit Boards and lead free solder connections. This paper also discusses X-ray inspection systems and their importance in failure analysis and process control in electronics manufacturing. In addition to describing basic X-ray technology, the paper looks at a number of recent developments in X-ray systems and shows how these developments improve the inspection of BGAs, flip chips, CSPs, and wafer bumps.

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