Pan Pacific Symposium Conference Proceedings


EFFECTS OF ADHESION PROMOTION TREATMENT ON ELECTRICAL SIGNAL ATTENUATION

Authors: Roger Krabbenhoft and Bruce Lee
Company: IBM Systems and Technology Group, and MacDermid Incorporated
Date Published: 1/31/2007   Conference: Pan Pacific Symposium


Abstract: Oxide alternatives, as well as traditional and reduced oxide chemistries, are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and the pre-preg resin used to bond the layers together in multi-layer printed circuit boards (PCBs). These chemistries impart varying degrees of roughness to the surface of the copper conductors and as a result electrical performance can be affected. The electrical performance characteristics of two oxide alternatives are examined in this study.



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