Pan Pacific Symposium Conference Proceedings


NANOPACKAGING

Authors: Rao Tummala, P. Markondeya Raj, Ankur Agrawal, Jack K. Moon, C. P. Wong, Janagama Goud, Tapobratha Bandyopadhyay, and Mahdevan Iyer
Company: Packaging Research Center Georgia Institute of Technology
Date Published: 1/31/2007   Conference: Pan Pacific Symposium


Abstract: In this paper, we show examples of the benefits of nanomaterials for packaging and how packaging technologies are migrating to nanoscale for the first time, to address the demands for convergent miniaturized systems with applications ranging from computing, wireless, health and security. Nanomaterials and nanopackaging are essential to meet the advances in nano ICs leading to true nanomodules, On the other hand, System-on-Package integration with embedded RF /digital /opto /sensing components relies on the latest innovations in functional nanomaterials, processes and nanostructures for superior electrical performance with size reduction.



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