Pan Pacific Symposium Conference Proceedings


LEAD-FREE SOLDER DURABILITY TESTING AT ACCELERATED THERMAL EXCURSIONS FOR QFN AND DFN PACKAGE INTERCONNECTS

Authors: Steve Sytsma and Mark Wrightson
Company: Hamilton Sundstrand
Date Published: 1/31/2007   Conference: Pan Pacific Symposium


Abstract: Hamilton Sundstrand’s (HS) subsidiary in Nördlingen, Germany is using a synchronous step down switching regulator from Linear Technology in a low voltage power supply (LVPS) application. This device is packaged in a 32 pin Quad Flat No-lead (QFN32) package. During thermal cycling tests there have been numerous instances of solder joint failures associated with this device. An evaluation of the PWB layout for this device and the solder stencil design has revealed deviations from the design features recommended by QFN32 manufacturers. Further, failure data shows that the use of conformal coating accelerates the failure mechanism. Key words: Quad Flat No-lead, QFN, Accelerated Life Testing, DOE, Design of Experiments, Durability, Reliability, Lead-free, Aerospace.



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