Pan Pacific Symposium Conference Proceedings


Authors: Wim Christiaens, Bart Vandevelde, Steven Brebels, and Jan Vanfleteren
Company: IMEC – TFCG Microsystems
Date Published: 1/31/2007   Conference: Pan Pacific Symposium

Abstract: Flexible materials are being used already today as base substrates for electronic assembly. A lot of mounted components, both active and passive components, could be integrated in flexible polyimide substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility: not only the interconnection but also the components themselves can be mechanically flexible. Two polyimide based embedding technologies are described. First, a polyimide based 60 µm foldable chip package is presented: the ultra-thin chip package (UTCP). Chips thinned down to 20 µm are packaged in between two polyimide layers.Next, very thin, flexible RF structures are realized. Multilayers are built-up on temporary rigid carrier substrates by repetitive application of polyimide layers by a spin-on process and metal layers by sputtering. Sputtered NiCr is used as resistor material, a thin spincoated PI as capacitor dielectric. Inductors, capacitors and resistors are interconnected with microstrip transmission lines, realizing multilayer RF structures. Key words: chip package, RF structure, flexible, 3D.

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