Surface Mount International Conference Proceedings


THE IMPACT OF CHIP SCALE PACKAGES ON THE SMT ASSEMBLY PROCESS

Authors: Robert J. Black, Jr.
Company: Zevatech
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: With the continuing increase in the numbers of I/O’s in active devices, and the desire for designing more and more function into less and less board real estate, the Micro BGA package has arisen as a popular choice which meets both of these objectives. This package is small in size, taking only the space of the silicon itself, and it has the advantage of all connection being below the part itself, requiring no peripheral area around the part for interconnect. The use of the Micro BGA package in a standard SMT process, however, requires some changes from the past. The areas specifically affected are; component feeding, component handling, vision recognition, and post placement inspection.



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