SMTA International Conference Proceedings


CHALLENGES IN HIGH-DENSITY PCB ASSEMBLY: NEW STRATEGIES FOR IMPROVING QUALITY INSPECTION AND TEST

Author: Ana I. De Marco
Company: Manufacturers' Services
Date Published: 9/12/1999   Conference: SMTA International


Abstract: INTRODUCTION With the rapid changes in mounting technology for PCB assemblies, new techniques are needed to inspect assemblies to accommodate for denser packaging. A study of these new technologies for inspection illustrates e the benefits of incorporating them into the process.

AOI (Automatic Optical Inspection) is one of those technologies. AOI can view a board in the same way that the human eye can, however it can do this in a much more efficient and faster manner than a human inspector. This can be achieved due to the fact that such technology does not suffer fatigue, and smaller component sizes and increased densities do not cause a problem.

The purpose of this study is to understand how AOI technology can be used effectively in a production environment and so get improvements in terms of quality and cost.

In order to do this, data was collected from an AOI system for three different test vehicles. With these three test vehicles, two production environments were tested: High-Volume Low-Complexity (HVLC) configurations and Low-Volume High-Complexity (LVHC) configurations. Comparison between performance of boards passed through AOI and boards from the normal process without AOI was carried out.



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