IWLPC (Wafer-Level Packaging) Conference Proceedings


STUDY OF Ni-P/Pd/Au AS A FINAL FINISH FOR WAFER

Authors: Kazuki Yoshikawa, Toshiaki Shibata, Masayuki Kiso,
Company: C. Uyemura & Company, Ltd. and Uyemura Internation
Date Published: 11/1/2006   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Thermal diffusion of Ni-P/Pd/Au deposits for wire bonding reliability was studied. Palladium was used in an attempt to decrease nickel diffusion into the surface gold deposit. Transmission Electron Microscopy, FE-SEM, Auger analysis and wire bond analysis were used to measure the reliability of the finishes discussed. The test results show the controlled Ni-P/Pd/Au deposit to exhibit excellent reliability for wire bonding.

Key words: Wire bonding, Palladium , Ni/Pd/Au, ENEPIG, ENIG



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