STUDY OF Ni-P/Pd/Au AS A FINAL FINISH FOR WAFERAuthors: Kazuki Yoshikawa, Toshiaki Shibata, Masayuki Kiso,
Company: C. Uyemura & Company, Ltd. and Uyemura Internation
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
Key words: Wire bonding, Palladium , Ni/Pd/Au, ENEPIG, ENIG
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