IWLPC (Wafer-Level Packaging) Conference Proceedings


THE IC PACKAGING WORLD AND ITS LATEST DEVELOPMENTS

Authors: Sandra L. Winkler
Company: Electronic Trend Publications
Date Published: 11/1/2006   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The worldwide integrated circuit (IC) market is steadily growing, and innovations at the packaging end continue to occur, which allow for greater innovation for end products. A number of technologies are coming to the foreground, including through-silicon vias in stacked packages, increased integration such as SiPs, embedded active devices in substrates, and larger-than-die-sized WLPs.

Key Words: IC packaging market, through-silicon vias, increased integration, larger-than-die-sized WLP



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