IWLPC (Wafer-Level Packaging) Conference Proceedings


THE EXPANSION OF WAFER LEVEL PACKAGING: CHALLENGES AND OPPORTUNITIES

Author: E. Jan Vardaman
Company: TechSearch International, Inc.
Date Published: 11/1/2006   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Shipments of wafer level packages (WLPs) have exceeded expectations, both in the number of units shipping and size and complexity of the devices. Once relegated to the few I/O range, wafer level packages are routinely shipping with more than 100 I/Os. They type of devices shipping in WLPs are expanding from integrated passives and analog devices, to a variety of integrated circuits including RF and memory. While many of the early parts were on 6-inch wafers, companies have migrated to 8-inch wafers and some companies will use 12-inch wafers in the future. What difficulties will be encountered with the expansion of WLPs? What are the opportunities for companies providing fabrication services, equipment, and materials? This paper examines the current status and provides projections for the future.

Key words: WLP, flip chip.



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