IWLPC (Wafer-Level Packaging) Conference Proceedings


USING THE 2D MACRO CD METROLOGY PACKAGE TO MEASURE CD LINES

Authors: Rajiv Roy, Matt Wilson, and Chris Hawes
Company: Rudolph Technologies
Date Published: 11/1/2006   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Automated Visual Inspection (AVI) systems are used extensively in Advanced packaging and Memory Outgoing QA areas. Recently customers have begun using these tools in-line to monitor process. An interesting use of AVI has been the use of CD measurement. CD measurement in the area of advanced packaging was done by a microscope. With AVI tools becoming faster and cost-effective CD measurements are also being done by these tools.



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