BCB WAFER BONDING WITH ELECTRICAL INTERCONNECTSAuthors: Praveen Pandojirao-S, Rachita Dewan, Dan O. Popa,
Company: Automation & Robotics Research Institute, The Univ
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
In this paper we report progress in simultaneous wafer level bonding and interconnect formation without the need for conventional via drilling and filling. We provide fabrication process parameters, preliminary interconnect DC characterization, and design guidelines for selecting interconnect diameters in typical MEMS applications.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.