Authors: M. Okamoto, S. Ito, S. Okude, T. Suzuki, O. Nakao, Company: Fujikura Ltd. Date Published: 11/1/2006
IWLPC (Wafer-Level Packaging)
Abstract: We have developed the IC chip embedded polyimide multilayer substrate as a small semiconductor package of the next generation. This substrate was made by stacking the circuit layers based on the polyimide film. We have achieved the process of embedding chips and laminating films at the same time, utilizing the conductive paste for the connection between layers and the connection to the chip. The chip has the copper rewiring layer using wafer level process to make this connection possible by the paste. At the same time, the chip is thinned down to 85um and embedded in the substrate. We have confirmed this substrate endured the reflow test of JEDEC Level2 and HAST.