IWLPC (Wafer-Level Packaging) Conference Proceedings


NON LITHOGRAPHIC MICROCELL PLATING FOR INTEGRATED PASSIVES AND RDL

Authors: P. Moller, M. Fredenberg, P. Leisner, M. Ostling
Company: Replisaurus Technologies AB, Acreo AB, and Royal I
Date Published: 11/1/2006   Conference: IWLPC (Wafer-Level Packaging)


Abstract: ECPR (ElectroChemical Pattern Replication) is a fabrication process for microscale metal patterns, characterized by high accuracy, high throughput and cost efficient production. Using ECPR, the cost of metallization for microelectronics can be reduced significantly compared to using lithography based processes. The technology utilizes a master electrode for electrochemical pattern replication, which enables direct metallization with high deposition rates, short cycle times, and fewer equipment modules.

ECPR provides metallization on most substrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 500/280 nm line/space with uniform material distribution and minimum line width variations.

Examples of applications suitable for ECPR metallization are wafer redistribution, integrated passives, ultra-fine pitch pillar bumping, advanced substrates/interposers and power-ICs.

Key words: Metal printing, microcell plating, copper metallization, electrochemical pattern replication.



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