NON LITHOGRAPHIC MICROCELL PLATING FOR INTEGRATED PASSIVES AND RDLAuthors: P. Moller, M. Fredenberg, P. Leisner, M. Ostling
Company: Replisaurus Technologies AB, Acreo AB, and Royal I
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
ECPR provides metallization on most substrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 500/280 nm line/space with uniform material distribution and minimum line width variations.
Examples of applications suitable for ECPR metallization are wafer redistribution, integrated passives, ultra-fine pitch pillar bumping, advanced substrates/interposers and power-ICs.
Key words: Metal printing, microcell plating, copper metallization, electrochemical pattern replication.
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