METROLOGY FOR ULTRA-THIN WAFER AND DIE STRENGTH CHARACTERIZATION AND RELATED EDGE DAMAGE AND MODELING CHALLENGESAuthors: David Liu, Anwei Liu, Michael I. Current, Wojtek J
Company: Frontier Semiconductor
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
Keywords: three-point bend, fracture strength, dicing damage
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