AEROSOL-JET PRINTING FOR 3-D INTERCONNECTS, FLEXIBLE SUBSTRATES AND EMBEDDED PASSIVESAuthors: Martin Hedges, Mike Kardos, Bruce King, and Mike R
Company: Neotech Services MTP and Optomec Inc.
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
The M3D printer utilizes low viscosity inks in the range of 1-1000 cP. Typical materials that can be printed include nanoparticle metal suspensions, polymers and adhesives. Conductor traces can be printed using gold or silver nanoparticle inks. Conductors can also be formed by printing a seed layer, followed by electroless copper plating. Polymer thick film pastes can be printed to form embedded resistors. Polyimide and various epoxies can be printed for adhesives, overcoat dielectrics, etc.
Substrates include silicon, polyimide, glass, FR-4 and aluminum oxide. In principle, virtually any substrate can be used provided the ink is compatible with it.
This new technology has been applied to areas such as embedded passives, flexible substrates, mask and circuit repair and conformal electronics. It is expected that it will find further applications in 3D packaging.
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