STAIR-STEP IC PACKAGES FOR LOW COST AND HIGH PERFORMANCEAuthor: Joseph Fjelstad
Company: SiliconPipe, Inc.
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
While optoelectronic interconnection solutions are being worked on as possible future solutions, electronic interconnection technologies are likely to the used far into the future. This is both due to the dominance of electronics and significant number of impediments to near term adoption of optical solutions. Optical data transmission technologies are stymied by such road block issues as high cost; high power requirements; limited infrastructure and lack of experienced engineers. Even so, for long distance signal transmission, optoelectronic solutions are unparalleled. However, it is cost effective transmission of signals over short distances that is needed. Lacking immediate cost effective and reliable solutions for optical interconnections, the near term challenge is to solve the problem of designing and constructing an optimal electrical signal channel. Digital signals in the gigabit-per-second range must overcome many of the same problems that have faced the designers of RF and microwave circuits in terms of managing signal loss. Designers must manage signal transitions along an often tortuous path from chip-to-chip and in doing so overcome the parasitic effects of all interconnections, beginning with the IC package.
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