EFFECTS OF PLASMA PRETREATMENT ON FLIP CHIP AND CSP SUBSTRATE LEVEL ASSEMBLY YIELD AND RELIABILITYAuthors: Daniel Baldwin, Ph.D., Paul Houston and Brian Lewi
Company: Georgia Institute of Technology and Engent, Inc.
Date Published: 11/1/2006 Conference: IWLPC (Wafer-Level Packaging)
Visual inspection of the plasma treated samples revealed higher more uniform fillet shapes especially in the corners of the components compared with the untreated devices. CSAM analysis indicated no significant difference between the plasma treated and non-plasma treated samples in terms of underfill uniformity and void formation during processing. The flow times for the plasma treated flip chip samples were 12 to 20 percent faster than the non-plasma treated samples. The flow times for the plasma treated CSPs were 55% faster than the flow times for the untreated samples. As for flip chip reliability differences, the plasma treated test vehicles with Au finish had the highest reliability with a 70 improvement over untreated samples. In contrast, the untreated flip chip assemblies with an OSP finish had 78% higher reliability compared with the plasma treated counterpoints. For the CSP components, the reliability of the components were generally the same as the non-Plasma treated samples.
Key Words: Plasma, Underfill, Flip Chip, Reliability, Yield
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